The semiconductor industry and the U.S. government are engaged in ambitious plans to expand domestic semiconductor manufacturing capacity. Previous CSET research has found that the CHIPS for America Act incentives, if carefully targeted and augmented by adequate regulatory and workforce support, could reverse the observable decline in U.S. semiconductor manufacturing capacity since 1990. This paper argues that targeted investment incentives to increase U.S.-based advanced packaging capacity are also important for innovation, supply chain security, and ongoing semiconductor industry leadership.

Through the Quad forum, the United States, Australia, Japan and India have committed to pursuing an open, accessible and secure technology ecosystem and offering a democratic alternative to China’s techno-authoritarian model. This report assesses artificial intelligence collaboration across the Quad and finds that while Australia, Japan and India each have close AI-related research and investment ties to both the United States and China, they collaborate far less with one another.

CSET Senior Fellow Andrew Lohn testified before the House of Representatives Science, Space and Technology Subcommittee on Investigations and Oversight and Subcommittee on Research and Technology at a hearing on "Securing the Digital Commons: Open-Source Software Cybersecurity." Lohn discussed how the United States can maximize sharing within the artificial intelligence community while reducing risks to the AI supply chain.

Offshoring the production of semiconductor manufacturing equipment would remove an important source of leverage over China and make the United States more dependent on other countries for some of the most important inputs to semiconductor manufacturing. This brief explores the factors driving U.S. SME firms to offshore production and what can be done to slow or reverse offshoring.

CSET Senior Fellow Andrew Lohn testified before the U.S. Senate Armed Services Subcommittee on Cybersecurity hearing on artificial intelligence applications to operations in cyberspace. Lohn discussed AI's capabilities and vulnerabilities in cyber defenses and offenses.

CSET submitted this comment to the Department of Commerce to inform incentives, infrastructure, and research and development needed to support a strong domestic semiconductor industry.

Like traditional software, vulnerabilities in machine learning software can lead to sabotage or information leakages. Also like traditional software, sharing information about vulnerabilities helps defenders protect their systems and helps attackers exploit them. This brief examines some of the key differences between vulnerabilities in traditional and machine learning systems and how those differences can affect the vulnerability disclosure and remediation processes.

CSET Research Analyst Dakota Cary testified before the U.S.-China Economic and Security Review Commission hearing on "China’s Cyber Capabilities: Warfare, Espionage, and Implications for the United States." Cary discussed the cooperative relationship between Chinese universities and China’s military and intelligence services to develop talent with the capabilities to perform state-sponsored cyberespionage operations.

CHIPS for America Act funding will result in the construction of new semiconductor fabrication facilities (“fabs”) in the United States, employing tens of thousands of workers. This policy brief assesses the occupations and backgrounds that will be most in-demand among new fabs, as well as options for ensuring availability of the necessary talent. Findings suggest the need for new immigration pathways for experienced foreign fab workers, and investments in workforce development.

Since 1990, the U.S. share of global semiconductor manufacturing capacity has declined while the shares of China, South Korea, and Taiwan have increased. If carefully targeted, CHIPS for America Act incentives could reverse this trend for the types of chips that matter most to U.S. national security. In this policy brief, the author assesses how CHIPS Act incentives should be distributed across different types of chips.