CSET submitted the following comment in response to a Request for Information (RFI) from the National Science Foundation (NSF) about the development of the newly established Technology, Innovation, and Partnerships (TIP) Directorate, in accordance with the CHIPS and Science Act of 2022.

CSET Research Analyst Dahlia Peterson testified before the U.S.-China Economic and Security Review Commission at a hearing on "China’s Challenges and Capabilities in Educating and Training the Next Generation Workforce."

The U.S. semiconductor supply chain’s resilience will meaningfully increase only if current efforts to re-shore fabrication (that is, to situate more facilities that make its key parts in the United States) are met with commensurate efforts to re-shore upstream material production along with downstream assembly, test, and packaging (ATP) of finished microelectronics.

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As an integral player in advanced semiconductor supply chains, the United States enjoys advantages over China in producing and accessing chips for artificial intelligence and other leading-edge computing technologies. However, a lack of domestic production capacity threatens U.S. semiconductor access. The United States can strengthen its advantages by working with allies and partners to prevent China from producing leading-edge chips and by reshoring its own domestic chipmaking capacity.

China’s State Key Laboratory system drives the country’s innovation in science and technology. A key part of China’s aim to reduce its dependence on foreign technology, these labs conduct cutting-edge basic and applied research, attract and train domestic and foreign talent, and conduct academic exchanges with foreign counterparts. These laboratories are spread across almost all Chinese provinces except Tibet, with the majority clustered in large coastal cities.

The semiconductor industry and the U.S. government are engaged in ambitious plans to expand domestic semiconductor manufacturing capacity. Previous CSET research has found that the CHIPS for America Act incentives, if carefully targeted and augmented by adequate regulatory and workforce support, could reverse the observable decline in U.S. semiconductor manufacturing capacity since 1990. This paper argues that targeted investment incentives to increase U.S.-based advanced packaging capacity are also important for innovation, supply chain security, and ongoing semiconductor industry leadership.

CSET Director Dewey Murdick testified before the Senate Select Committee on Intelligence hearing on "Countering the People’s Republic of China’s Economic and Technological Plan for Dominance." Murdick discussed China's strategy to move towards self-sufficiency in key technologies and steps the United States can take to respond.

Offshoring the production of semiconductor manufacturing equipment would remove an important source of leverage over China and make the United States more dependent on other countries for some of the most important inputs to semiconductor manufacturing. This brief explores the factors driving U.S. SME firms to offshore production and what can be done to slow or reverse offshoring.

CSET submitted this comment to the Department of Commerce to inform incentives, infrastructure, and research and development needed to support a strong domestic semiconductor industry.