The U.S. semiconductor supply chain’s resilience will meaningfully increase only if current efforts to re-shore fabrication (that is, to situate more facilities that make its key parts in the United States) are met with commensurate efforts to re-shore upstream material production along with downstream assembly, test, and packaging (ATP) of finished microelectronics.

As an integral player in advanced semiconductor supply chains, the United States enjoys advantages over China in producing and accessing chips for artificial intelligence and other leading-edge computing technologies. However, a lack of domestic production capacity threatens U.S. semiconductor access. The United States can strengthen its advantages by working with allies and partners to prevent China from producing leading-edge chips and by reshoring its own domestic chipmaking capacity.

The semiconductor industry and the U.S. government are engaged in ambitious plans to expand domestic semiconductor manufacturing capacity. Previous CSET research has found that the CHIPS for America Act incentives, if carefully targeted and augmented by adequate regulatory and workforce support, could reverse the observable decline in U.S. semiconductor manufacturing capacity since 1990. This paper argues that targeted investment incentives to increase U.S.-based advanced packaging capacity are also important for innovation, supply chain security, and ongoing semiconductor industry leadership.

Through the Quad forum, the United States, Australia, Japan and India have committed to pursuing an open, accessible and secure technology ecosystem and offering a democratic alternative to China’s techno-authoritarian model. This report assesses artificial intelligence collaboration across the Quad and finds that while Australia, Japan and India each have close AI-related research and investment ties to both the United States and China, they collaborate far less with one another.

Offshoring the production of semiconductor manufacturing equipment would remove an important source of leverage over China and make the United States more dependent on other countries for some of the most important inputs to semiconductor manufacturing. This brief explores the factors driving U.S. SME firms to offshore production and what can be done to slow or reverse offshoring.

Data Snapshots are informative descriptions and quick analyses that dig into CSET’s unique data resources. This is the fourth in a series of Snapshots exploring CSET’s Private-sector AI-Related Activity Tracker (PARAT). Check in every two weeks to see our newest Snapshot, and explore PARAT, which collects data related to companies’ AI research and development to inform analysis of the global AI sector.

CSET submitted this comment to the Department of Commerce to inform incentives, infrastructure, and research and development needed to support a strong domestic semiconductor industry.

CHIPS for America Act funding will result in the construction of new semiconductor fabrication facilities (“fabs”) in the United States, employing tens of thousands of workers. This policy brief assesses the occupations and backgrounds that will be most in-demand among new fabs, as well as options for ensuring availability of the necessary talent. Findings suggest the need for new immigration pathways for experienced foreign fab workers, and investments in workforce development.

Since 1990, the U.S. share of global semiconductor manufacturing capacity has declined while the shares of China, South Korea, and Taiwan have increased. If carefully targeted, CHIPS for America Act incentives could reverse this trend for the types of chips that matter most to U.S. national security. In this policy brief, the author assesses how CHIPS Act incentives should be distributed across different types of chips.

Devices based on superconductor electronics can achieve much higher energy efficiency than standard electronics. Research in superconductor electronics could advance a range of commercial and defense priorities, with potential applications for supercomputing, artificial intelligence, sensors, signal processing, and quantum computing. This brief identifies the countries most actively contributing to superconductor electronics research and assesses their relative competitiveness in terms of both research output and funding.